![Thomas Alsop](https://cdn.statcdn.com/static/../CMS/contactperson/ERI2474_1592296757.jpg)
Global semiconductor wafer-level packing and assembly equipment spending 2014-2020
The statistic depicts the level of wafer-level packaging and assembly equipment spending worldwide, from 2014 to 2020. In 2017, waver-level packaging and assembly equipment spending is forecast to reach 2.03 billion U.S. dollars.